IEEE SWISS SSCS TALK : Circuits and Signaling Co-Design for Ultra-Wideband Communications by Prof. Armin Tajalli

Share

Modern multi-core multi-processor computing systems rely on high-bandwidth data communication between different units in such distributed systems. Chip-to-chip communication over very short distances is now becoming a very demanding topic of research. Due to heat, yield, and performance concerns, many companies are moving toward multi-chip-module (MCM) SoCs.

In such systems, the data rate as well as energy consumption are extremely crucial. Due to stringent power budget, industry is seeking out for new design methodologies to implement very dense and energy-efficient links. The main focus of this talk is on techniques to implement such high-performance links over copper. Using novel circuit architectures in conjunction with low ISI sensitivity signaling method allows to implement very energy-efficient and very high-speed links.



  Date and Time

  Location

  Contact

  Registration



  • ETHZ
  • Gloriastrasse 35
  • Zurich, Switzerland
  • Switzerland
  • Building: ETF
  • Room Number: C 109
  • Starts 07 June 2019 04:00 AM
  • Ends 17 June 2019 07:00 PM
  • All times are Europe/Zurich
  • No Admission Charge
  • Register


  Speakers

Armin Tajalli

Biography:

Armin Tajalli received his B.S. from Sharif University of Technology, Tehran, Iran, and the Ph.D.
from Swiss Federal Institute of Technology (EPFL), Lausanne, Switzerland. He was part of
initiating team and a Senior Analog Architect with Kandou Bus, Lausanne, Switzerland (2010-
2017). Since December 2017, he has joined as an Assistant Professor to the University of Utah,
Salt Lake City, USA. He has published more than 80 articles in peer reviewed journals and
conferences, and holds 30+ patents. He has received several awards, including The Best Paper
Award in DesignCon (2016), PhD Prime Award at EPFL, Switzerland (2010), and IEEE
AMD/CICC Scholarship (2009).

Email:

Address:Electrical & Computer Engineering Department, 50 S. Central Campus Dr Merril Engineering Building (MEB 2224), Salt Lake City, Utah, United States, UT 84112-9249





  Media

Presentation This document include the onslide presentation of the seminar 7.39 MiB
SSCReport Report Sent for Solid State Chapter news 520.61 KiB